Integrated MEMS for RF Communicators and Microfluidic Biochip

In this talk, integrated 3D RF MEMS passives will be presented as a viable solution to provide high-performance on-chip RF components. High-Q inductors and low-loss transmission lines have been integrated on top of 0.18um CMOS for fully-integrated 5GHz and 13GHz VCOs. RF MEMS switches with low actuation voltage less than 5V will be also presented using the combination of electromagnetic actuation and electrostatic holding. In the second part of the talk, a microfluidic chip with multiple micro-wells in two dimensional array for cellular manipulation and assay will be introduced. The chip performs single cell positioning, specific reagent injection and secretion monitoring for possible high-throughput cell analysis and drug screening. A few examples of implementing microfluidic components utilizing chaotic advection, lamination of flow and surface tension will be also discussed.
Euisik Yoon received his B.S. and M.S. degrees in Electronics Engineering from Seoul National University in 1982 and 1984, respectively, and his Ph.D. degree in Electrical Engineering from the University of Michigan, Ann Arbor, in 1990.

From 1990 to 1994 he worked for the Fairchild Research Center of the National Semiconductor Corp. in Santa Clara, CA, where he engaged in researching deep submicron CMOS integration and advanced gate dielectrics.

From 1994 to 1996 he was a Member of the Technical Staff at Silicon Graphics Inc. in Mountain View, CA, where he worked on the design of the MIPS microprocessor R4300i and the RCP 3-D graphic coprocessor.

From 1996 to 2005 he was with the Department of Electrical Engineering at the Korea Advanced Institute of Science and Technology (KAIST) in Taejon, Korea. In 2005, he joined the Department of Electrical and Computer Engineering at the University of Minnesota in Minneapolis, MN. His research interests are in MEMS, integrated microsystems, and VLSI circuit design.

Dr. Yoon was the co-recipient of the Student Paper Award at the IEEE International Microwave Symposium in 1999 and 2000, respectively, concerning topics on MEMS inductors and RF MEMS switch work. He's served on various Technical Program Committees including Microprocesses and Nanotechnology Conference, International Sensor Conference and IEEE AP ASIC Conference, IEEE MEMS conference and Tansducers conference. Currently, he is serving on the IEEE ISSCC program committee and IEEE IEDM technical program committee.