Semiconductor Technology Roadmap: A Paradigm for Nanomanufacturing?

Historically, the semiconductor industry has followed an aggressive roadmap in order to continually improve the cost-per-functionality and drive innovation in scaling and device performance. Lithography improvements have been instrumental to attributing to steady increase in device density. Over the past few decades, several innovations in lithography have occurred to enable this scaling trend. More recently, new technologies such as extreme ultraviolet (EUV) and direct-write e-beam have been under development as the "next generation lithography" technologies. However, ongoing challenges prevent these technologies to advance from "next generation" to high-volume manufacturing solutions. The conventional roadmap involves simultaneous scaling of dimensions, tolerances, and defectivity. With some of these attributes challenged by scaling existing or the introduction of new techniques, are there alternative directions for the semiconductor roadmap? This presentation will demonstrate how the semiconductor roadmap can be applied to the broader area of nano-manufacturing.
Michael Lercel is SEMATECH's senior director and chief technologist. In this role he is responsible for leading the consortium's technical vitality and excellence, and guiding SEMATECH's technical Centers of Competence.
Prior to joining SEMATECH, Lercel was senior director of EUV product marketing at Cymer, where he was responsible for EUV source product roadmaps. Preceding that, Lercel served in various lithography and process-related positions at IBM for 14 years, most recently as Strategic Equipment Council manager.
While on assignment from IBM, Lercel served as SEMATECH's director of Lithography from 2005-2008, spearheading the development of various lithography options such as 193 nm high-index immersion, double patterning, and extreme ultraviolet lithography (EUVL), as well as alternative technologies such as nanoimprint and maskless.
Lercel holds a doctorate in physics from Cornell University where he studied nanofabrication on ultra-thin films, as well as a bachelor's degree in physics from Massachusetts Institute of Technology.