Communications and Signal Processing Seminar

Next Generation Receivers w/ Qualcomm Research Info Session

Tingfang JiPrincipal EngineerQualcomm Research

This talk includes two parts: Qualcomm Research overview; latest advances in 4G cellular systems, especially receiver enhancements. After the talk, I would like to stay for extended Q&A and to collect resumes and pre-screen interns and full-time candidates.

4G cellular systems have seen great success in commercial adoption in the past 3 years. In this talk, we provide an overview of the latest features that are being studied and specified in 3GPP, such as Device-to-Device communications, small cell enhancements, carrier aggregation enhancements and network assisted interference cancellation and suppression. Then we zoom in on the last feature in the list (NAICS), which is expected to introduce a new breed of receivers that has never been commercialized in a mobile terminal. The list of candidate receivers include: E-LMMSE-IRC (enhanced MMSE interference rejection combining), SLIC (symbol level interference cancellatin), R-ML (reduced complexity ML), CWIC (codeword level IC), etc. We will analyze the complexity, signaling and performance tradeoff for a few most interesting receiver types and discuss future research directions.
Tingfang Ji is a Principal Engineer and manager at Qulacomm Research. He joined Qualcomm in 2003 as one of the key technical contributors to the initial development of wideband OFDMA technologies that evolved into IEEE 802.20 and 3GPP2 UMB standards. Since 2008, he has represented Qualcomm in 3GPP LTE-Advanced standardization in physical layer and radio working groups. Since 2011, he has been elected the radio working group vice chairman overseeing base station and mobile baseband performance standardization. His research interests include interference coordination and cancellation, network MIMO, relay, mobility enhancement, low power terminal and RF designs for multi-band multi-radio systems.

He received his B.S. degree in EE from Tsinghua University, Beijing in 1995. He received his M.S and Ph.D degrees both in EE from the Univ. of Toledo Ohio and the Univ. of Michigan, Ann Arbor in 1997 and 2001, respectively. After graduation, he worked in the advanced technology department at Bell Labs until 2003.

Sponsored by

University of Michigan, Department of Electrical Engineering & Computer Science