Innovative Fabrication, Integration, and Packaging for Reliable Microsystems
NSF Center for Advanced Manufacturing and Packaging of Microwave, Optical, and Digital Electronics (CAMPmode)
Dept of Mechanical Engineering
University of Colorado in Boulder
MEMS research at the University of Colorado in Boulder (UCB) has been focused on MEMS reliability through innovative design, materials, fabrications methods, modeling, and measurement techniques.
In order to build reliable devices, advanced design knowledge and concepts must emphasize interactions among thermal, mechanical, chemical, and atomic effects bridging the necessary nano- and micro-scales. The materials/fabrication/packaging must focus on nano-scale materials synthesis and characterization, as well as material processing and packaging technologies that are critical to assure device reliability. The technologies that this talk is focused on include: atomic layer deposited nanoscale coatings, self-assembly of MEMS using surface tension forces, flip-chip MEMS assembly and packaging
Victor M. Bright received his BSEE degree from the University of Colorado at Denver in 1986, and the M.S. and Ph.D. degrees from the Georgia Institute of Technology, in 1989 and 1992, respectively.
Dr. Bright is a Professor of Mechanical Engineering at the University of Colorado at Boulder and an Associate Director of NSF Center for Advanced Manufacturing and Packaging of Microwave, Optical and Digital Electronics (CAMPmode). Prior to joining the University, he was an Associate Professor in the Department of Electrical and Computer Engineering, Air Force Institute of Technology, Wright-Patterson Air Force Base, Ohio (6/92-12/97). Prof. Bright's research activities include micro-electro-mechanical systems (MEMS), silicon micromachining, microsensors/ microactuators, opto-electronics, ceramic MEMS, MEMS reliability, and MEMS packagingDr. Bright serves on the Executive Committee of American Society of Mechanical Engineers (ASME) MEMS Sub-Division. Prof. Bright served on the Technical Program Committee for the IEEE MEMS 2000, 2001, 2002, and 2003 conferences.