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ECE 528: Principles of Microelectronics Process Technology

Coverage
Explore principles and theory of micro- and nanofabrication. Will focus on some practical topics. Understand the physics and chemistry involved in microfabrication, and be able to apply to your future research and processes

Textbook
Silicon VLSI Technology, J. D. Plummer, M. D. Deal, and P. B. Griffin (Prentice Hall 2000)

Syllabus outline

  • Semiconductor material and processes: wafer cleaning, bulk crystal growth, epitaxial growth, defects, oxidation, diffusion, and ion implantation.
  • Surface characterization techniques, SIMS, XPS, AES, etc.
  • Subwavelength optical lithography: resist systems, diffraction limits, resolution enhancement techniques (phase shifting, optical proximity correction, immersion lithography).
  • Other lithographic technologies: X-ray, electron beam, ion beam lithography, and nanoimprint lithography.
  • Etching: wet chemical etching, ion beam assisted etching, neural beam etching, plasma etching, reactive ion etching, and high density plasma sources.
  • Deposition: Electron beam evaporation, sputter deposition, chemical vapor deposition, and plasma enhanced chemical vapor deposition.